We bond driver ICs and flexible circuits to display glass at our Rabale facility. Compact modules, precise connections and local engineering support, built around your application.
A display’s performance starts at its connections. At Highness, we bring two complementary bonding capabilities together to meet your mechanical, electrical and space requirements.
We bond the driver IC directly to the glass using anisotropic conductive film (ACF). This reduces the module footprint and the number of interconnections, supporting compact designs with reliable signal transmission.
For designs where every millimetre matters.
We bond a flexible printed circuit to the glass using ACF. The flexible connection gives you more freedom to route electronics behind the display and integrate a slim module into your enclosure.
For flexible routing and slim display assemblies.
Our Rabale team handles bonding in-house, bringing process control and engineering support closer to your product development.
Clean-room processing with controlled alignment, temperature, pressure and bonding time.
Checks from component placement through post-bond electrical testing.
Work with our local team on your design, prototype and production requirements.
Review the display, interface and enclosure requirements with our engineers.
Prepare the glass and accurately position the IC or flexible circuit.
Form the connection using ACF under controlled process conditions.
Inspect the bond and test electrical performance before further assembly.
Compact displays for handheld equipment.
Integrated panels with space constraints.
Instrument clusters and slim display modules.
Tell us what you’re building. Our team can help you choose the bonding approach for your design.
Get in touchShare what you have. We can work through the details together.
